A reliable thermal solution of processor is always highly appreciated for most applications. The reliable solution is not only about whether the processor over its thermal specification or keep its temperature under protection point but also noise and weight related. EZCool is the reliable thermal solution for Intel® Core™ 2 Duo processor, Pentium® 4 651 and Celeron® D 352 and so on that Thermal Design Power (TDP) does not over 65W because of it's compact size, silent cooling fan and fixing mechanism.
Along with Intel®'s Core™ Mircoarchitecture and advanced manufacturing technologies, processor Thermal Design Power (TDP) was lower from 85~130W to 65W only, and even lower for single core processor in Q3 this year. As a result, Portwell is able to design a reliable cooler that can fits most applications demanding.
EZCool is just one of third height of boxed cooler that benefits applications that need low profile cooler.
Larger preload of cooler cause the main board bending and it could
introduce permanent damage to the PCB (Print Circuit Board) and traces
on it. With back plate conjunction, EZCooler makes no defection of board.
Main board fixed vertically in chassis instead of horizontally such as PICMG 1.x
SBC/SHB can be twisted because of the weight of cooler. It damages SBC/SHB
badly once the platform vibrates or shocks in the same direction.
The semi-symmetric heat sink design only allows air flow thru dual
directions that can help ventilation of other key components nearby and
fully leverage system air flow that draw from outside of the chassis.
Specifications are subject to change without notice.
Pentium® 4, Pentium® III, Pentium® II and Celeron® are registered trademarks of Intel® Corporation.
Xeon™ is a trademark of Intel® Corporation.
Other trademarks, logos, brands and company names are the property of their respective owners.